With low permeability to gases and liquids, FFKM compounds provide consistent sealing performance in demanding environments. They also offer flame resistance and strong electrical insulation, making them a great choice for applications that require both thermal stability and dielectric properties.

Designed to withstand exposure to over 1,600 different chemicals, FFKM remains stable against strong acids, bases, and organic solvents, with the exception of fluorinated solvents. Its durability in aggressive environments makes it well-suited for chemical processing, semiconductor manufacturing, and industrial sealing applications.

With a density of 1.9–2.0 g/cm³, FFKM compounds feature a smooth, uniform surface that prevents cracks, porosity, or pinholes. This improves sealing efficiency and enhances long-term material durability in critical applications.

Performs reliably at continuous temperatures from -10°C to 288°C, with short-term resistance up to 315°C. Even at 300°C, compression set remains below 50%, and exposure to 316°C constant heat or 343°C intermittent high temperatures does not cause hardening or brittleness, allowing it to maintain elasticity and sealing integrity over time.